Language	Label	Description	Alias
English	wire bonding	-	-
Japanese	ワイヤーボンディング	-	-

Language	English
Label	wire bonding
Description
Alias

Language	Japanese
Label	ワイヤーボンディング
Description
Alias

Semantic Relatives

Parent

Q3091: semiconductor fabrication

Siblings:

• Q3436: dicing
• Q3437: die bonding
• Q3439: sealing
• Q3440: package