Language	Label	Description	Alias
English	die bonding	-	-
Japanese	ダイボンディング	-	-

Language	English
Label	die bonding
Description
Alias

Language	Japanese
Label	ダイボンディング
Description
Alias

Semantic Relatives

Parent

Q3091: semiconductor fabrication

Siblings:

• Q3438: wire bonding
• Q3436: dicing
• Q3439: sealing
• Q3440: package