wire bonding (Q3438): Difference between revisions
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(Changed label, description and/or aliases in ja) |
(Created claim: has broader (P8): semiconductor fabrication (Q3091)) |
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| Property / has broader | |||
| Property / has broader: semiconductor fabrication / rank | |||
Normal rank | |||
| Property / has broader: semiconductor fabrication / reference | |||
Latest revision as of 00:40, 6 March 2023
No description defined
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | wire bonding |
No description defined |