Difference between revisions of "die bonding (Q3437)"
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(Created a new Item) |
(Created claim: has broader (P8): semiconductor fabrication (Q3091)) |
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| label / ja | label / ja | ||
| + | ダイボンディング | ||
| Property / has broader | |||
| + | |||
| Property / has broader: semiconductor fabrication / rank | |||
| + | Normal rank | ||
| Property / has broader: semiconductor fabrication / reference | |||
| + | |||
Latest revision as of 00:39, 6 March 2023
No description defined
| Language | Label | Description | Also known as |
|---|---|---|---|
| English |
die bonding
|
No description defined
|