Language	Label	Description	Alias
English	cooling structure
Japanese	冷却構造

Language	English
Label	cooling structure
Description
Alias

Language	Japanese
Label	冷却構造
Description
Alias

Semantic Relatives

Parent

Q3072: peripheral structure

Siblings:

• Q3148: wire bonding
• Q3149: chip bonding
• Q3150: heat dissipation sructure
• Q3152: sealed package
• Q3153: other package structures